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MSD (Moisture Sensitive Device) Control for the Module

The xPico 600 module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below.

  1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35-60%.
  2. Shelf life (in vacuum-sealed packaging): 12 months in Recommended Storage Condition.
  3. Floor life: 168 hours in a factory where the temperature is 23 ±5 °C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10% (e.g. a dry cabinet).
  4. The module should be pre-baked to avoid blistering, cracks, and inner-layer separation in PCB under the following circumstances:
    • The module is not stored in Recommended Storage Condition;
    • Violation of the third requirement mentioned above;
    • Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
    • Before module repairing.
  5. If needed, the pre-baking should follow the requirements below:
    • The module should be baked for 24 hours at 120 ±5 °C;
    • The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet.